Fast Monotonic Via Assignment Excluding Mold Gates for 2-Layer Ball Grid Array Packages

A Via Assignment and Global Routing Method for 2-Layer Ball Grid Array Packages

Routing of Monotonic Parallel and Orthogonal Netlists for Single-Layer Ball Grid Array Packages

Semiconductor Packaging Assembly Technology

This chapter describes the fundamentals of the processes used by National Semiconductor to assemble IC devices in electronic packages. Electronic packaging provides the interconnection from the IC to the printed circuit board (PCB). Another function is to provide the desired mechanical and environmental protection to ensure reliability and performance. Three fundamental assembly flow processes ...

Long Term Aging Effects on the Reliability of Lead Free Solder Joints in Ball Grid Array Packages with Various Pitch Sizes and Ball Alignments

This paper investigates the impact of isothermal aging on the long-term reliability of lead-free solder joints. The full experimental matrix contains SAC105 and SAC305 solder alloys assembled in ball grid arrays (BGAs) with package sizes ranging from 19mm, 0.8mm pitch to 5mm, 0.4mm pitch, and three surface platings (ImAg, ENIG, and ENEPIG). The test specimens were subjected to isothermal aging ...

Study of IMC vs Drop Test effect on Leadfree SAC and Polymer Solder Ball

Leaded solder ball was replaced by leadfree solder ball which is now widely used in semiconductor industries, due to the hazardous effects of lead to human’s health and toxicity for environment. Due to this, poor solder joint strength for Ball Grid Array (BGA) packages on leadfree devices is a reliability concern when subjected to reliability stress test. With a polymer core in the solder ball ...